Hold without adhesives: Researchers of TU Ilmenau present nano hook and loop tape at Microtechnology/Hannover Messe

Long lasting hold without any stickiness: a special method of fixing miniaturized devices in microproduction will be presented by Technische Universität Ilmenau at the IVAM Product Market Mikro, Nano & Materials at Microtechnology/Hannover Messe. From April 16 to 20, experts of the Faculty of Mechanical Engineering will explain the bonding of microsystems with nano-scaled silicon needles which work like a hook and loop tape.

The so-called black silicon was known until now as a rather unwanted side effect of ion etching processes. As a completely new application, TU Ilmenau has now figured out mechanical contacts in micro assembly and packaging. The needle-like structures stick together and cause a solid connection this way without any adhesives. The 50 to 100 nanometer barbed structure of the needle side walls provides the wanted hook and loop effect. If the bonding force is low, the connection is detachable, while high bonding forces effect a permanent connection. The diameter of the needles varies from 300 to 900 nanometers from tip to bottom. They can be dispersed homogeneously on full wafers or restricted to even buried areas. Application areas are, for example, the fixing of smallest devices before gluing, the bonding of wafers at room temperature and the modification of fluidic and bio-medical structures.

More information about the Product Market Micro, Nano & Materials on 700 square meters (hall 15/booth D 34) under www.ivam.de. IVAM Microtechnolgy Network already accepts reservations for 2008. Katrin Manka (Phone: +49 231 9742 7081; E-mail: answer your questions.km@ivam.de) will be happy to answer your questions.

Topic: Micro-Nano-Opto, Production and engineering, 51ccbe67dba47c94399326aed46ff3a3, New Materials and Chemistry
Source: IVAM

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	Hold without adhesives: Researchers of TU Ilmenau present nano hook and loop tape at Microtechnology/Hannover Messe Long lasting hold without any stickiness: a special method of fixing miniaturized devices in microproduction will be presented by Technische Universität Ilmenau at the IVAM Product Market Mikro, Nano & Materials at Microtechnology/Hannover Messe. From April 16 to 20, experts of the Faculty of Mechanical Engineering will explain the bonding of microsystems with nano-scaled silicon needles which work like a hook and loop tape. The so-called black silicon was known until now as a rather unwanted side effect of ion etching processes. As a completely new application, TU Ilmenau has now figured out mechanical contacts in micro assembly and packaging. The needle-like structures stick together and cause a solid connection this way without any adhesives. The 50 to 100 nanometer barbed structure of the needle side walls provides the wanted hook and loop effect. If the bonding force is low, the connection is detachable, while high bonding forces effect a permanent connection. The diameter of the needles varies from 300 to 900 nanometers from tip to bottom. They can be dispersed homogeneously on full wafers or restricted to even buried areas. Application areas are, for example, the fixing of smallest devices before gluing, the bonding of wafers at room temperature and the modification of fluidic and bio-medical structures. More information about the Product Market Micro, Nano & Materials on 700 square meters (hall 15/booth D 34) under www.ivam.de. IVAM Microtechnolgy Network already accepts reservations for 2008. Katrin Manka (Phone: +49 231 9742 7081; E-mail: answer your questions.km@ivam.de) will be happy to answer your questions. Topic: Micro-Nano-Opto, Production and engineering, 51ccbe67dba47c94399326aed46ff3a3, New Materials and Chemistry Source: IVAM	Print page Back